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data sheet v1.10 2010-04 microcontrollers 32-bit TC1766 32-bit single-chip microcontroller bare die delivery
edition 2010-04 published by infineon technologies ag 81726 munich, germany ? 2010 infineon technologies ag all rights reserved. legal disclaimer the information given in this document shall in no event be regarded as a guarantee of conditions or characteristics. with respect to any ex amples or hints given herein, any typi cal values stated herein and/or any information regarding the application of the device, infi neon technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual property rights of any third party. information for further information on technology, delivery terms and conditions and prices, please contact the nearest infineon technologies office ( www.infineon.com ). warnings due to technical requirements, components may contain dangerous substances. for information on the types in question, please contact the nearest infineon technologies office. infineon technologies components may be used in life-suppo rt devices or systems only with the express written approval of infineon technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system or to affect the safety or effectiveness of that device or system. life support devices or systems are intended to be implanted in the human body or to support and/or maintain and sustain and/or protect human life. if they fail, it is reasonable to assume that the health of the user or other persons may be endangered.
data sheet v1.10 2010-04 microcontrollers 32-bit TC1766 32-bit single-chip microcontroller bare die delivery
TC1766 bare die delivery data sheet v1.10, 2010-04 trademarks tricore? is a trademark of infineon technologies ag. TC1766 data sheet revision history: v1.10, 2010-04 previous version: v1.8 page subjects ( changes since v1.8) 24 die placement on surf tape is updated, pad 1 of the die is located at the bottom of the surf tape. 3 , 4 , 19 , 26 , 27 information for carrier tape packing are included at these sections - features, ordering information, storage condit ions, die placement and dimension. we listen to your comments any information within this document that you feel is wrong, unclear or missing at all? your feedback will help us to continuousl y improve the quality of this document. please send your proposal (including a reference to this document) to: mcdocu.comments@infineon.com
TC1766 bare die delivery table of contents data sheet 1 v1.9d4, 2009-07 trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 we listen to your comments . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 1 summary of features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 ordering information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 2 general device information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 2.1 block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 2.2 pad configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 2.3 pad configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 2.4 pad definitions and functions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 3 electrical parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 3.1 general parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 3.1.1 pad driver and pad classes summary . . . . . . . . . . . . . . . . . . . . . . . . . 18 3.1.2 storage conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 3.1.3 operating conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 3.2 dc parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 3.2.1 input/output pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 3.3 wafer characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 4 packaging . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 4.1 chip outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 4.2 surf tape characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 4.3 carrier tape characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 table of contents
TC1766 bare die delivery 32-bit single-chip microcontroller data sheet 2 v1.10, 2010-04 1 summary of features ? high-performance 32-bit super-scaler tr icore v1.3 cpu with 4-stage pipeline ? superior real-time performance ? strong bit handling ? fully integrated dsp capabilities ? single precision floating point unit (fpu) ? 80 mhz operation at full temperature range ? peripheral control processor with single cycle instruction (pcp2) ? 8 kbyte parameter memory (pram) ? 12 kbyte code memory (cmem) ? multiple on-chip memories ? 56 kbyte local data memory (sram) ? 8 kbyte overlay memory ? 16 kbyte scratch-pad ram (spram) ? 8 kbyte instruction cache (icache) ? 1504 kbyte program flash (for inst ruction code and constant data) ? 32 kbyte data flash (e.g. 4 kbyte eeprom emulation) ? 16 kbyte boot rom ? 8-channel dma controller ? fast-response interrupt system with 2 x 255 hardware priority arbitration levels serviced by cpu or pcp2 ? high-performance on-chip bus structure ? 64-bit local memory bu s (lmb) to flash memory ? system peripheral bus (spb) for inte rconnections of functional units ? versatile on-chip peripheral units ? two asynchronous/synchronous serial channels (ascs) with baudrate generator, parity, framing and overrun error detection ? two high speed synchronous serial channels (sscs) with programmable data length and shift direction ? one micro second bus (msc) interface for serial port expansion to external power devices ? two high-speed micro link interfaces (mlis) for serial inter-processor communication ? one multican module with two can nodes and 64 free assignable message objects for high efficiency data handling via fifo buffering and gateway data transfer
TC1766 bare die delivery summary of features data sheet 3 v1.10, 2010-04 ? one general purpose timer array module (gpta) with a powerful set of digital signal filtering and timer functionalit y to realize autonomous and complex input/output management ? one 16-channel analog-to-digital converter unit (adc) with select able 8-bit, 10-bit, or 12-bit, supporting 32 input channels ? one 2-channel fast analog-to-digital converter unit (fadc) with concatenated comb filters for hardware da ta reduction: supporting 10-bi t resolution, with minimum conversion time of 262.5ns ? 32 analog input lines for adc and fadc ? 81 digital general purpose i/o lines ? digital i/o ports with 3.3 v capability ? on-chip debug support for ocds level 1 and 2 (cpu, pcp, dma) ? dedicated emulation device chip for multi-core debugging, tracing, and calibration via usb v1.1 interface available (TC1766ed) ? power management system ? clock generation unit with pll ? core supply voltage of 1.5v ? i/o voltage of 3.3 v ? die temperature under operati ng condition: -40 to +150c ? packaging: bare dies mounted on surf tape 1) 1) surf tape packing will be replaced by carrier tape packing in the second quarter of 2010.
TC1766 bare die delivery summary of features data sheet 4 v1.10, 2010-04 ordering information the ordering code for infineon microcontro llers provides an exact reference to the required product. this ordering code identifies: ? the derivative itself, i.e. its function set, the temperature range, and the supply voltage ? the package and the type of delivery for the available ordering codes for the TC1766 bare die, please refer to the ?product catalog microcontrollers? that summarize s all available microcontroller variants. this document describes the derivatives of the device. table 1 enumerates the derivative. TC1766 bare die data sheet mainly covers bare die related parameters and specification issues. all other TC1766 characte ristics and parameters are defined in the TC1766 package data sheet. note: all references of this document are based on v1.0 or higher of the TC1766 package data sheet. table 1 TC1766 derivative synopsis derivative package notes/conditions sal-TC1766-192f80u bare die mounted on surf tape 1) t d = -40 o c to +150 o c; f sys = 80 mhz; 8 kbyte ovram
TC1766 bare die delivery general device information data sheet 5 v1.10, 2010-04 2 general device information 2.1 block diagram figure 1 TC1766 block diagram dma 8 ch. bi0 8 kb pram pcp2 core 12 kb cmem interrupts f fp i f cpu system peri phe ral bus (spb) ports sbcu mcb06056_bd mult i can (2 nodes, 64 buf f er) stm ext. request unit lbcu lf i bridge ocds debug interface/jtag abbreviations: i cache: i nst ruct ion cache spram: scratch-pad ram ldram: local dat a ram ovram: overlay ram brom: boot rom pf lash: program f lash df lash: dat a f lash pram: paramet er memory in pcp cmem: code memory in pcp shaded: o nly available in t c1766ed mli0 tricore (tc1.3m) pmi 1 6 kb spram 8 kb i cache dmi 56 kb ldram cps 16 kb brom 1504 kb pf lash 32 kb dflash pmu gpta fpu asc1 asc0 mem check emulat ion memory i nt erf ace 8 kb ovram overlay me chan ism mli1 fadc 2 ch. adc0 32 ch. analog input assi gnme nt ssc1 ssc0 dma bus pll scu pll emulat ion memory i nt erf ace fpi-bus interface local memory bus (lmb) bi1 smif msc0
TC1766 bare die delivery general device information data sheet 6 v1.10, 2010-04 2.2 pad configuration figure 2 TC1766 pad configuration 8 7 9 fcln0 fclp0a testmode bypass nmi hdrst porst v ss msc0 control digital circuitry power supply general control sop0a son0 v dd v ddp an[35:0] a dc analog inputs v ddm v ssm v ddmf v ssmf v ddaf v ssaf v aref0 v agnd0 v faref v fagnd v ddfl3 a dc/fadc analog power supply mcb0606 6 port 0 16-bit v ddosc3 alternate functions brkout xtal1 xtal2 oscillator tdi tck trst port 1 15-bit port 2 14-bit port 3 16-bit port 4 4-bit gpta, scu gpta, ssc1, adc ssc0/1, mli0, gpta, msc 0 asc0/1, ssc0/1, scu, ca n tdo ocds / jtag control gpta, scu tms brkin trclk v ddosc v ssosc port 5 16-bit gpta, ocds l2, mli0/1 v ssosc3 TC1766
TC1766 bare die delivery general device information data sheet 7 v1.10, 2010-04 2.3 pad configuration note: there are four pad pairs which are conv erted to giant pads in bf-step, these are pad pairs numbered 25 and 26, 65 and 66, 169 and 170, 190 and 191. for more details, please refer to footnotes 2 to 5 in table 2 . figure 3 TC1766 pad configuration (top view) 116 179 180 115 1 x 0.0 231 0. 0 y 54 55 pad_config_c
TC1766 bare die delivery general device information data sheet 8 v1.10, 2010-04 2.4 pad definitions and functions table 2 pad definitions and functions pad num pad name (symbol) in / out position [mm] function xy 1 an19 i 321 40 analog input 19 2 an18 i 446 40 analog input 18 3 an17 i 571 40 analog input 17 4 an16 i 696 40 analog input 16 5 an15 i 821 40 analog input 15 6 an14 i 946 40 analog input 14 7 v agnd ? 1071 40 adc reference ground 8 v aref ? 1196 40 adc reference voltage 9 v ssm ? 1321 40 adc analog part ground 10 v ddm ? 1446 40 adc analog part power supply (3.3 v) 11 an13 i 1571 40 analog input 13 12 an12 i 1696 40 analog input 12 13 an11 i 1821 40 analog input 11 14 an10 i 1946 40 analog input 10 15 an9 i 2071 40 analog input 9 16 an8 i 2196 40 analog input 8 17 an6 i 2321 40 analog input 6 18 an5 i 2446 40 analog input 5 19 an4 i 2571 40 analog input 4 20 an3 i 2696 40 analog input 3 21 an2 i 2821 40 analog input 2 22 an1 i 2946 40 analog input 1 23 an0 i 3071 40 analog input 0 24 v dd ? 3335 40 core and logic and sram memory power supply (1.5v) 25 v ss 1)2) ? 3415 40 ground 26 v ss 1)2) ? 3495 40 27 v dd ? 3575 40 core and logic and sram memory power supply (1.5v)
TC1766 bare die delivery general device information data sheet 9 v1.10, 2010-04 28 v ddp ? 3665 40 io power supply (3.3v) 29 v ddp ? 3755 40 io power supply (3.3v) 30 v ss ? 3845 40 ground 31 v dd 1) ? 3925 40 core and logic and sram memory power supply (1.5v) 32 v ss ? 4015 40 ground 33 p1.14 i/o 4117 40 port 1 line 14 34 p1.13 i/o 4206 40 port 1 line 13 35 p1.12 i/o 4296 40 port 1 line 12 36 p2.0 i/o 4385 40 port 2 line 0 37 p2.1 i/o 4474 40 port 2 line 1 38 p2.2 i/o 4564 40 port 2 line 2 39 p2.3 i/o 4653 40 port 2 line 3 40 p2.4 i/o 4743 40 port 2 line 4 41 p2.5 i/o 4832 40 port 2 line 5 42 p2.6 i/o 4922 40 port 2 line 6 43 p2.7 i/o 5011 40 port 2 line 7 44 v ss ? 5113 40 ground 45 v ss ? 5203 40 ground 46 v ddp ? 5293 40 io power supply (3.3 v) 47 v dd ? 5383 40 core and logic and sram memory power supply (1.5v) 48 v ss 1) ? 5463 40 ground 49 v dd ? 5553 40 core and logic and sram memory power supply (1.5v) 50 v ss ? 5633 40 ground 51 v ss ? 5723 40 ground 52 p4.0 i/o 5825 40 port 4 line 0 53 p4.1 i/o 5914 40 port 4 line 1 54 p4.2 i/o 6003 40 port 4 line 2 table 2 pad definitions and functions (cont?d) pad num pad name (symbol) in / out position [mm] function xy
TC1766 bare die delivery general device information data sheet 10 v1.10, 2010-04 55 p4.3 i/o 6286 325 port 4 line 3 56 p1.0 i/o 6286 492 port 1 line 0 57 p1.1 i/o 6286 658 port 1 line 1 58 p1.2 i/o 6286 824 port 1 line 2 59 p1.8 i/o 6286 991 port 1 line 8 60 p1.9 i/o 6286 1157 port 1 line 9 61 p1.10 i/o 6286 1324 port 1 line 10 62 p1.11 i/o 6286 1490 port 1 line 11 63 p1.3 i/o 6286 1656 port 1 line 3 64 v dd ? 6286 1750 core and logic and sram memory power supply (1.5 v) 65 v ss 1)3) ? 6286 1830 ground 66 v ss 1)3) ? 6286 1920 67 v dd ? 6286 2000 core and logic and sram memory power supply (1.5v) 68 v ddp ? 6286 2090 io power supply (3.3 v) 69 v ddp ? 6286 2180 io power supply (3.3 v) 70 v ss ? 6286 2270 ground 71 v dd 1) ? 6286 2350 core and logic and sram memory power supply (1.5v) 72 v ss ? 6286 2440 ground 73 xtal1 i 6286 2686 oscillator/pll/clock generator input 74 xtal2 o 6286 2766 oscillator/pll/clock generator output 75 v ssosc ? 6286 2861 main oscillator ground 76 v ssosc ? 6286 2951 main oscillator ground 77 v ddosc ? 6286 3031 main oscillator power supply (1.5 v) 78 v dd 1) ? 6286 3111 core and logic and sram memory power supply (1.5v) 79 v ss 1) ? 6286 3191 ground 80 v ddosc3 ? 6286 3281 oscillator power supply (3.3 v) table 2 pad definitions and functions (cont?d) pad num pad name (symbol) in / out position [mm] function xy
TC1766 bare die delivery general device information data sheet 11 v1.10, 2010-04 81 v ddp ? 6286 3416 io power supply (3.3 v) 82 v ss 1) ? 6286 3506 ground 83 p1.4 i/o 6286 3620 port 1 line 4 84 v ddp 1) ? 6286 3743 io power supply (3.3 v) 85 p1.5 i/o 6286 3867 port 1 line 5 86 p1.6 i/o 6286 3979 port 1 line 6 87 p1.7 i/o 6286 4090 port 1 line 7 88 tdi i 6286 4202 jtag module serial data input 89 tms i 6286 4348 jtag module state machine control input 90 tdo o 6286 4494 jtag module serial data output 91 trst i 6286 4641 jtag module reset/enable input 92 tck i 6286 4787 jtag module clock input 93 brkout o 6286 4946 ocds break output 94 brkin i 6286 5026 ocds break input 95 testmode i 6286 5106 test mode select input 96 bypass i 6286 5265 pll bypass control input 97 nmi i 6286 5424 non-maskable interrupt input 98 porst i 6286 5504 power-on reset input 99 hdrst i/o 6286 5663 hardware reset input / reset indication output 100 v dd ? 6286 5822 core and logic and sram memory power supply (1.5 v) 101 v ss 1) ? 6286 5902 ground 102 v ss 1) ? 6286 5992 ground 103 v dd ? 6286 6072 core and logic and sram memory power supply (1.5v) 104 v ddp ? 6286 6162 io power supply (3.3 v) 105 v ddp ? 6286 6252 io power supply (3.3 v) 106 v ss ? 6286 6342 ground table 2 pad definitions and functions (cont?d) pad num pad name (symbol) in / out position [mm] function xy
TC1766 bare die delivery general device information data sheet 12 v1.10, 2010-04 107 v dd 1) ? 6286 6422 core and logic and sram memory power supply (1.5v) 108 v ss ? 6286 6512 ground 109 p3.5 i/o 6286 6670 port 3 line 5 110 p3.6 i/o 6286 6817 port 3 line 6 111 p3.8 i/o 6286 6963 port 3 line 8 112 p3.2 i/o 6286 7110 port 3 line 2 113 p3.3 i/o 6286 7256 port 3 line 3 114 p3.7 i/o 6286 7402 port 3 line 7 115 p3.4 i/o 6286 7549 port 3 line 4 116 p3.15 i/o 6007 7852 port 3 line 15 117 p3.14 i/o 5925 7852 port 3 line 14 118 p3.1 i/o 5844 7852 port 3 line 1 119 p3.0 i/o 5763 7852 port 3 line 0 120 p3.10 i/o 5681 7852 port 3 line 10 121 p3.9 i/o 5600 7852 port 3 line 9 122 v ss 1) ? 5506 7852 ground 123 v ddp ? 5426 7852 io power supply (3.3 v) 124 v ddp ? 5302 7852 io power supply (3.3 v) 125 v ss ? 5222 7852 ground 126 v dd 1) ? 5142 7852 core and logic and sram memory power supply (1.5v) 127 v ss ? 5062 7852 ground 128 v ss 1) ? 4982 7852 ground 129 v dd 1) ? 4902 7852 core and logic and sram memory power supply (1.5v) 130 v ddp ? 4822 7852 flash memory power supply (3.3 v) 131 v ddp 1) ? 4742 7852 flash memory power supply (3.3 v) 132 v ss 1) ? 4617 7852 ground 133 v ddp ? 4537 7852 io power supply (3.3 v) table 2 pad definitions and functions (cont?d) pad num pad name (symbol) in / out position [mm] function xy
TC1766 bare die delivery general device information data sheet 13 v1.10, 2010-04 134 p3.13 i/o 4443 7852 port 3 line 13 135 p3.12 i/o 4362 7852 port 3 line 12 136 p3.11 i/o 4281 7852 port 3 line 11 137 p0.0 i/o 4199 7852 port 0 line 0 138 p0.1 i/o 4118 7852 port 0 line 1 139 p0.2 i/o 4036 7852 port 0 line 2 140 p0.3 i/o 3955 7852 port 0 line 3 141 p0.8 i/o 3874 7852 port 0 line 8 142 p0.9 i/o 3792 7852 port 0 line 9 143 p0.10 i/o 3711 7852 port 0 line 10 144 p0.11 i/o 3629 7852 port 0 line 11 145 v dd ? 3536 7852 core and logic and sram memory power supply (1.5v) 146 v ss 1) ? 3456 7852 ground 147 v ss 1) ? 3376 7852 ground 148 v dd ? 3296 7852 core and logic and sram memory power supply (1.5v) 149 v ddp ? 3216 7852 flash memory power supply (3.3 v) 150 v ss ? 3136 7852 ground 151 v dd 1) ? 3056 7852 core and logic and sram memory power supply (1.5v) 152 v ss ? 2976 7852 ground 153 fcln0 o 2886 7852 msc0 differential driver clock output negative 154 fclp0a o 2766 7852 msc0 differential driver clock output positive a 155 son0a o 2666 7852 msc0 differential driver serial data output negative a 156 sop0a o 2546 7852 msc0 differential driver serial data output positive a 157 nc 1) ? 2296 7852 lvds reference table 2 pad definitions and functions (cont?d) pad num pad name (symbol) in / out position [mm] function xy
TC1766 bare die delivery general device information data sheet 14 v1.10, 2010-04 158 p2.9 i/o 2042 7852 port 2 line 9 159 p2.10 i/o 1960 7852 port 2 line 10 160 p2.11 i/o 1879 7852 port 2 line 11 161 p2.12 i/o 1797 7852 port 2 line 12 162 p2.8 i/o 1716 7852 port 2 line 8 163 p2.13 i/o 1635 7852 port 2 line 13 164 p0.4 i/o 1553 7852 port 0 line 4 165 p0.5 i/o 1472 7852 port 0 line 5 166 p0.12 i/o 1390 7852 port 0 line 12 167 p0.13 i/o 1309 7852 port 0 line 13 168 v dd ? 1215 7852 core and logic and sram memory power supply (1.5v) 169 v ss 1)4) ? 1135 7852 ground 170 v ss 1)4) ? 1055 7852 171 v dd ? 975 7852 core and logic and sram memory power supply (1.5v) 172 v ddp ? 895 7852 io power supply (3.3 v) 173 v ss ? 815 7852 ground 174 v dd 1) ? 735 7852 core and logic and sram memory power supply (1.5v) 175 v ss ? 655 7852 ground 176 p0.6 i/o 561 7852 port 0 line 6 177 p0.7 i/o 480 7852 port 0 line 7 178 p0.14 i/o 398 7852 port 0 line 14 179 p0.15 i/o 317 7852 port 0 line 15 180 p5.0 i/o 40 7553 port 5 line 0 181 p5.1 i/o 40 7376 port 5 line 1 182 p5.2 i/o 40 7200 port 5 line 2 183 p5.3 i/o 40 7023 port 5 line 3 184 p5.4 i/o 40 6847 port 5 line 4 table 2 pad definitions and functions (cont?d) pad num pad name (symbol) in / out position [mm] function xy
TC1766 bare die delivery general device information data sheet 15 v1.10, 2010-04 185 p5.5 i/o 40 6671 port 5 line 5 186 p5.6 i/o 40 6494 port 5 line 6 187 p5.7 i/o 40 6318 port 5 line 7 188 trclk o 40 6129 ocds l2 trace clock 189 v dd ? 40 5928 core and logic and sram memory power supply (1.5 v) 190 v ss 1)5) ? 40 5848 ground 191 v ss 1)5) ? 40 5758 192 v dd ? 40 5678 core and logic and sram memory power supply (1.5 v) 193 v ddp ? 40 5588 io power supply (3.3 v) 194 v ddp ? 40 5498 io power supply (3.3 v) 195 v ss ? 40 5408 ground 196 v dd 1) ? 40 5328 core and logic and sram memory power supply (1.5 v) 197 v ss ? 40 5238 ground 198 p5.8 i/o 40 5049 port 5 line 8 199 p5.9 i/o 40 4872 port 5 line 9 200 p5.10 i/o 40 4696 port 5 line 10 201 p5.11 i/o 40 4520 port 5 line 11 202 p5.12 i/o 40 4343 port 5 line 12 203 p5.13 i/o 40 4167 port 5 line 13 204 p5.14 i/o 40 3990 port 5 line 14 205 p5.15 i/o 40 3814 port 5 line 15 206 v dd 1) ? 40 3690 core and logic and sram memory power supply (1.5 v) 207 v ss 1) ? 40 3610 ground 208 v ssaf ? 40 3336 fadc ground 209 v ddaf ? 40 3256 fadc analog part logic power supply (1.5v) 210 nc ? 40 3131 not connected table 2 pad definitions and functions (cont?d) pad num pad name (symbol) in / out position [mm] function xy
TC1766 bare die delivery general device information data sheet 16 v1.10, 2010-04 note: although not all pads are bonded in TC1766 package, it is recommended to bond as many supply pads as possible in system. note: all v ss pads must be externally connected together. v dd pads of the same type (e.g. all v ddp lines) should be externally connected together. 211 v ddmf ? 40 2946 fadc analog power supply (3.3v) 212 v ssmf ? 40 2821 fadc ground 213 v faref ? 40 2696 adc reference voltage 214 v fagnd ? 40 2571 adc reference ground 215 an35 i 40 2446 fadc[1] negative analog input 35 216 an34 i 40 2321 fadc[1] positive analog input 34 217 an33 i 40 2196 fadc[0] negative analog input 33 218 an32 i 40 2071 fadc[0] positive analog input 32 219 an31 i 40 1821 analog input 31 220 an30 i 40 1696 analog input 30 221 an29 i 40 1571 analog input 29 222 an28 i 40 1446 analog input 28 223 an7 i 40 1321 analog input 7 224 an27 i 40 1196 analog input 27 225 an26 i 40 1071 analog input 26 226 an25 i 40 946 analog input 25 227 an24 i 40 821 analog input 24 228 an23 i 40 696 analog input 23 229 an22 i 40 571 analog input 22 230 an21 i 40 446 analog input 21 231 an20 i 40 321 analog input 20 1) this pad is not bonded in TC1766 package devices 2) giant pad 1 with the dimension of 162 m x 253.22 m 3) giant pad 2 with the dimension of 162 m x 253.22 m 4) giant pad 3 with the dimension of 152 m x 253.22 m 5) giant pad 4 with the dimension of 152 m x 253.22 m table 2 pad definitions and functions (cont?d) pad num pad name (symbol) in / out position [mm] function xy
TC1766 bare die delivery general device information data sheet 17 v1.10, 2010-04 note: all dimensions refer to the corner of the die (0,0) within the chip sealing ring. appropriate adjustment must be ma de to include sawing tolerances.
TC1766 bare die delivery electrical parameters data sheet 18 v1.10, 2010-04 3 electrical parameters 3.1 general parameters 3.1.1 pad driver and pad classes summary please refer to the TC1766 package data sheet for the overview of the different pad driver classes and its basic characteristics, dc parameters and absolute maximum ratings. table 3 shows the assignments of all digital i/o pads to pad classes and to v dd power supply pads. table 3 assignments of digital pads to pad classes and power supply pads pads pad classes power supply port 0, port 1 [7:0], port 1 [14:12], port 2 line 4, port 2 [7:6], port 2 line 13, port 3 [11:10], port 4 [1:0], tdi, bypass class a1 (3.3 v) v ddp v ss port 1 [11:8], port 2 [3:0], port 2 line 5, port 2 [12:8], port 3 [9:0], port 3 [15:12], port 4 [3:2], port 5, trst , tck, tdo, tms, nmi ,porst , hdrst class a2 (3.3 v) v ddp brkin , brkout class a3 (3.3 v) v ddp trclk class a4 (3.3 v) v ddp fclp0a, fcln0, sop0a, son0 class c (nominal 3.3 v) v ddp an31 to an0 v aref0, v agnd0 class d (nominal 3.3 v) v ddm v ssm an35 to an32 v faref, v fagnd class d (nominal 3.3 v) v ddmf, v ddaf v ssmf v ssaf xtal1, xtal2 (nominal 3.3 v) v ddosc3 v ddosc v ssosc no functional pads assigned for flash module (nominal 3.3 v) v ddfl3 v ss
TC1766 bare die delivery electrical parameters data sheet 19 v1.10, 2010-04 3.1.2 storage conditions TC1766 dies may be stored for a certain time under the conditions described below. the dies shall be processed before end of maximum storage time is expired. processing beyond expiring date is on user?s risk. the storage time starts wit h the product date code. table 4 bare die storage conditions and duration storage type ambient atmosphere storage condition storage time bare dies mounted on surf tape 1) with nitto film. reels with surf- tape inclusive of desiccant sealed in moisture barrier bag 1) surf tape packing will be replaced by carrier tape packing in the second quarter of 2010. air atmosphere: >99% nitrogen or inert gas temperature: 17c ? 25c humidity: 7-25% rh pressure: slightly above ambient atmospheric pressure max. 6 months bare dies mounted on carrier tape, protected with cover tape. reels with carrier- tape inclusive of desiccant sealed in moisture barrier bag max. 12 months
TC1766 bare die delivery electrical parameters data sheet 20 v1.10, 2010-04 3.1.3 operating conditions please refer to the TC1766 package data sheet for the details of the operating condition parameters. this section docume nts the operating condition parameters that are not specified in the TC1766 package data sheet. table 5 operating condition parameters parameter symbol limit values unit notes conditions min. max. digital supply voltage 1) 1) digital supply voltages applied to the TC1766 must be st atic regulated voltages which allow a typical voltage swing of 5%. v ddsram sr 1.42 1.58 2) 2) voltage overshoot up to 1.7 v is permissible at power-up and porst low, provided the pulse duration is less than 100 s and the cumulated summary of the pulses does not exceed 1 h. v? temperature of the bottom side of the die t d sr -40 +150 c? overload current i ov ?0 ma 3) 3) an overload condition is not intended to be a normal operating condition.
TC1766 bare die delivery electrical parameters data sheet 21 v1.10, 2010-04 3.2 dc parameters 3.2.1 input/output pins table 6 provides the characteristics of the inpu t/output pins which are specific for the TC1766 bare die. please refer to the TC1766 package data sheet for the common input/output dc characteristics. table 6 input/output dc characteristics (operating conditions apply) parameter symbol limit values unit notes conditions min. max. class a pads (3.3v - 5% v ddp 3.3v - 3%) output high voltage 1) 1) i oh and v oha are based on t d = 150c. v oha cc 2.4 ? v i oh =-1.3ma for medium driver mode, a1/a2 pads v ddp - 0.6 ?v i oh =-1ma for medium driver mode, a1/a2 pads i oh = -280 a for weak driver mode, a1/a2 pads class a pads (3.3v - 3% < v ddp 3.3v + 5%) note: please refer to TC1766 package data sheet.
TC1766 bare die delivery electrical parameters data sheet 22 v1.10, 2010-04 3.3 wafer characteristics table 7 wafer characteristics item characteristic metallization layers 7 metallization material 1st metallisation: cu 2nd metallisation: cu 3rd metallisation: cu 4th metallisation: cu 5th metallisation: cu 6th metallisation: cu 7th metallisation (bd-step): alcu 7th metallisation (bf-step): alcu, nip, pd, au metallization thickness met1: 0.29 m met2: 0.32 m met3: 0.33 m met4: 0.32 m met5: 0.55 m met6: 0.55 m met7(bd-step): 1.2 m met7(bf-step): 4.53 m topside passivation oxide/nitride /imide (subject to change) 0.45 / 0.4 / 5 m backside metallization none (silicon), must be connected to v ss
TC1766 bare die delivery packaging data sheet 23 v1.10, 2010-04 4 packaging 4.1 chip outline figure 4 chip outline (top view) chip_outline 300 7892 6326 d1 65 65 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . typical dimensions in m pad 1 x y pad 54 54 55 115 116 pad 231 179 180 80 d2 d3
TC1766 bare die delivery packaging data sheet 24 v1.10, 2010-04 table 8 dimensions of pads layout 4.2 surf tape characteristics note: surf tape packing will be replaced by carrier tape packing in the second quarter of 2010. figure 5 die placement on surf tape (top view) parameter symbol l imit values unit min. typ. max. distance between pads d1 80 125 274 m distance from border of die to border of chip, x-axis d2 057 114 m distance from border of die to border of chip, y-axis d3 0104208 m surftape _config pad 1 pad 231 sprocket holes sticky tape
TC1766 bare die delivery packaging data sheet 25 v1.10, 2010-04 figure 6 surf tape dimensions
TC1766 bare die delivery packaging data sheet 26 v1.10, 2010-04 4.3 carrier tape characteristics figure 7 die placement on carrier tape (top view) carriertape _config pad 1 pad 231 sprocket holes
TC1766 bare die delivery packaging data sheet 27 v1.10, 2010-04 figure 8 carrier tape dimensions
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